Manufacture, process and supply plastic, insulation and rubber products to industry

Plastic, insulation and rubber products

Manufacture, process and supply plastic, insulation and rubber products to industry

www.par-group.co.uk
Preston (Head office): +44 (0) 1257 248369:
Manchester: +44 (0) 1706 363790

Back to search results

Vespel® Rod

Vespel® rod is a very high performance material and offers exceptional wear, impact and creep resistance. It has high strength, but offers very limited resistance towards acids, alkalis and steam.

Applications

Vespel® Grade	Applications	Composition
SP-1	Mechanical and electrical parts at elevated temperatures. Valve seats, seals, insulators.	Unfilled. Provides maximum strength and elongation, the lowest modulus and thermal conductivity and optimum electrical properties.
SP-21	Lubricated or non-lubricated, low friction and wear applications. Valve seats, seals, bearings, washers, seal rings.	15% graphite filled. Provides enhanced inherent wear resistance and improves long term thermal stability.
SP-211	Low friction and wear applications in moderate temperature and PV environments. Bearings (bushings and washers).	10% PTFE, 15% Graphite filled. Provides the lowest static friction.
SP-3	Friction and wear applications in vacuum or inert gases. Bearings, piston rings and seals.	15% MoS2 filled. Provides the best wear performance in dry environments.

Key Features

Temperature: Up to +288°C continuous (+482°C short term).
Exceptional strength and impact resistance.

Availability

Also available: Vespel® Sheet and Vespel® Tube.

Vespel® Grades:

SP-1 - Unfilled.
SP-21 - Graphite Filled.
SP-211 - PTFE & Graphite Filled.
SP-3 - MoS2 Filled.

Rod Length (mm):

965.

Rod Diameter (mm):

3.1 up to 82.5 (SP-1, SP-21).

6.3 up to 82.5 (SP-211, SP-3).

Vespel® Grade	Rod Length (mm)	Rod Diameter (mm)
-	-	3.1	6.3	9.5	11.1	12.7	15.8	19.0	25.4	31.7	38.1	50.8	63.5	82.5
SP-1	965	*	*	*	*	*	*	*	*	*	*	*	*	*
SP-21	965	*	*	*	*	*	*	*	*	*	*	*	*	*
SP-211	965	-	*	*	*	*	*	*	*	*	*	*	*	*
SP-3	965	-	*	*	*	*	*	*	*	*	*	*	*	*